Equipment usage: mainly used for high reliable products IC and base adhesive after completion of work, about the quality of the bonding and wire bonding to do 100%.Chip bonding and the bonding quality of the product has a close relationship with the final quality of reliability.
* Basic requirements: through the optical detection system can automatically identify the chip bonding position accuracy, chip bonding direction, chip scratch in the bonding process and bonding material overflow is uniform, etc.;Wire bonding can detect the position of the golden, golden ball diameter, whether in the process of bonding desoldering, wrong welding, bonding of gold thread radian, lap welding, the short term.Detection can be formed after the completion of quality reports, including fault location, fault point and data statistical analysis, as the basis of quality tracking in the future.
二、The way of obtain the tender documents and time
All those who are willing to participate in the bids are kindly requested tocontact Room 2112, New CEIEC Building, Block A,Guohai Plaza, No. 17 Fuxing Road, Haidian District,Beijing,China to obtain bidding documents at the following address from Dec 26,2016 to Jan.6,2017 from 9:300am (Beijing Time) to 16:00pm(Beijing time)(Saturday, Sundays and holidays except), upon non-refundable payment of RMB800 or US$ 130for each complete set of bidding documents for each IFB.
三、Bid opening, bidding deadline time
Bid opening and bidding deadline time:2017-1-17 10:00AM
四、The place of opening bid
CEIEC:New Electronics Building, Guohai Plaza, 17 Fuxing Road, Beijing,China
五、 Name of Tendering Agent: CEIEC
Detailed Address: New Electronics Building, Guohai Plaza, 17 Fuxing Road, Beijing,China
Postcode:100036
Contact person: Ms.LISHIJUN
Tel: (010) (略) (略)
Fax: (010) (略)
Email:
Bank of Deposit::West bank of communications Beijing branch
Account No.(RMB): (略)(略)
Bank of Deposit: Bank of China Head Office (For USD yuan)
Account No.(USD): 7783 5004 0098